高体分SiC/Al与若干电子封装基板材料的对比  

Comparison of high volume fraction SiC/Al and a number of substrate materials for electronic packaging

作　　者：包建勋[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电子测试》2015年第10期121-122,共2页Electronic Test

摘　　要：综合比较了传统电子封装基板材料与高体积分数SiC/Al复合材料的各方面性能,结果显示,高体分SiC/Al复合材料具有优异的机械与热物理综合性能,且制备成本适中,线膨胀系数可根据不同的半导体材料特性进行调整,因此是基板材料的较佳备选材料。The performances of the traditional electronic packaging substrate materials and high volumefraction SiC/Al composites were compared. The results show that the high volume fraction SiC/Al composites have excellent mechanical and thermal properties, and the cost is moderate. The linear expansion coefficient can be adjusted according to the characteristics of different materials, so it is a good material for the substrate.

关 键 词：高体积分数SiC/Al 电子封装 基板材料 制备工艺 

分 类 号：TN05[电子电信—物理电子学]