基于LTCC的原位加热焊接工艺研究  

Study of Self-Heating Soldering in LTCC

作　　者：徐洋[1] 刘志辉[1] 岳帅旗[1] 

机构地区：[1]中国电子科技集团公司第29研究所,四川成都610036

出　　处：《电子工艺技术》2015年第6期319-322,共4页Electronics Process Technology

摘　　要：在多功能陶瓷基板上气密焊接金属微框是微系统模块集成制造过程中常见的组装需求,目前常规的工艺路线存在着设备依赖性强、焊接状态差异较大和返修困难等问题。介绍了一种原位自给式的焊接工艺,可用于低温共烧陶瓷基板金属微框的选择性焊接和快捷返修。研究了集成热源电阻器的设计、仿真、制作、空载测试、微框焊接及返修。结果表明,原位加热焊接微框的气密性完全满足国军标的要求。Hermetic soldering metal frames on multi-functional ceramic substrate is needed commonly in the micro system module integration. The conventional process has several problems including strongly equipment dependence, soldering state difference and repair difficulty. A method of self-support soldering is introduced which can be used in selective soldering and convenient repairing micro frames in LTCC ISP substrate. The design, simulation, fabrication, test, frame soldering and repair of integrated resistors which act as heat source were studied. The test result shows that the value of hermetization can fully satisfy the demand of military standard.

关 键 词：低温共烧陶瓷 自给式 气密焊接 

分 类 号：TN4[电子电信—微电子学与固体电子学]