GPP器件关键工艺设备制造技术研究  

The Research on Manufacture for the GPP Parts Process Equipment

作　　者：曹秀芳[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2015年第11期8-10,共3页Equipment for Electronic Products Manufacturing

摘　　要：简要介绍了GPP二极管工艺制造流程,着重阐述了P-N结钝化玻璃保护覆层制作工艺中V型沟槽的湿法刻蚀工艺,通过溶液温度、溶液流场及晶圆旋转运动控制技术,实现沟槽湿法刻蚀深度、宽度等均匀性,从而保证玻璃覆层的厚度及附着性,提高GPP二极管的性能。This paper introduces the process technologies for GPP diode （Glassivation passivation parts）, and expounds emphatically the V-shaped grooves wet etching process for P-N junction passivation protection coating glass, Excellent depth and width uniformity of V-shaped groove can be achieved through the technologies of solution temperature control, solution flow field control and wafer motion control, To ensure that the glass coating thickness and adhesion, improve the perfonnance of GPP diode.

关 键 词：晶圆 玻璃钝化二极管 湿法刻蚀 

分 类 号：TN605[电子电信—电路与系统]