共晶键合与减薄技术的压电能量采集器（英文）  

Fabrication of micro piezoelectric energy harvester using eutectic bonding and polishing technology

作　　者：李以贵[1] 颜平[1] 黄远[1] 杉山进[2] 

机构地区：[1]上海应用技术学院理学院,上海201418 [2]日本立命馆大学微系统系

出　　处：《强激光与粒子束》2016年第6期62-66,共5页High Power Laser and Particle Beams

基　　金：supported by National Natural Science Foundation of China(60777016);Lian-meng Plan Foundation of Shanghai(LM201441);Shanghai Institute of Technology Foundation(YJ 2014-03,10210Q150005)

摘　　要：采用微硅-锆钛酸铅(Si-PZT)悬臂梁结构并在悬臂梁末端附加镍质量块,构成可以工作于低频环境(小于1 000Hz)的微压电能量采集器,一种利用压电效应将环境振动能转换为电能的器件。利用金薄膜作为中间层的共晶键合技术和PZT研磨减薄技术制备了微压电悬臂梁结构,PZT减薄实验最好结果为减薄至8μm。镍质量块(2mm×2mm×0.6mm)采用微电铸工艺制备。通过对硅片与块材PZT的共晶键合工艺与PZT减薄技术的研究,制备出总厚度约为71μm的Si-PZT悬臂梁结构,其中硅梁厚约为47μm,PZT梁厚约为24μm。制备的微压电振动能量采集器样品的测试结果表明:在谐振频率为950 Hz,1.0g加速度激励条件下,其交流输出峰值电压可达958mV。This paper presents an energy harvester which operates at less than 1 kHz and consists of a mi-cro silicon-lead zirconate titanate （Si-PZT） cantilever and a nickel mass block on the cantilever. The energy har-vester is a device that can convert the ambient mechanical vibration into electrical energy employing the piezoe-lectric effect. The micro piezo cantilever structure was fabricated by eutectic bonding using gold thin film as abonding layer. A PZT mechanical polishing process was used to thin the bulk PZT. The thinnest PZT film ob-tained was 8 fire. A nickel mass block （2 mm X 2 mm X 0.6 ram） was fabricated using micro electroformingprocess. By optimizing the bonding and polishing processes, the thickness of fabricated Si-PZT cantilever was a-bout 71 fire, and the thicknesses of the silicon beam and the PZT beam were about 47 ffm and 24 fire, respec-tively. The results showed that the AC output voltage of the micro energy harvester was around 958 mV at theresonant frequency of 950 Hz and the acceleration of 1.0g.

关 键 词：微制造 能量采集器 减薄技术 共晶键合 锆钛酸铅 

分 类 号：TN384[电子电信—物理电子学]