HTCC一体化管壳失效问题分析  

Failure Analysis of HTCC Integral Substrate/Package

作　　者：邱颖霞[1] 胡骏[1] 刘建军[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2016年第3期41-44,共4页Electronics & Packaging

摘　　要：针对HTCC一体化管壳在后道封装中出现的瓷体裂纹、渗胶变色、多余物等失效问题,通过过程应力仿真、材料物理性能测试、失效点检测、工艺对比实验等方法分析原因。并进一步开展了改进验证。对HTCC一体化管壳工程化应用具有借鉴意义。Failure phenomenon of the HTCC integral substrate/package such as ceramic crack, gel or paste infiltration, redundant particles after sealing were found in packaging or reliability testing. FA analysis was carried out through simulation, material parameters test, visual inspections and antithesesexperiments. The results were ins^uctional for mass production with using the HTCC integral substrate/package.

关 键 词：HTCC一体化管壳 瓷体裂纹 渗胶变色 多余物 

分 类 号：TN305.94[电子电信—物理电子学]