LTCC厚薄膜混合基板加工研究  

Study on LTCC Thick and Thin Film Hybrid Substrate Fabrication

作　　者：党元兰[1] 赵飞[1] 唐小平 梁广华[1] 卢会湘 严英占[1] 刘晓兰 

机构地区：[1]中国电子科技集团公司第54研究所,河北石家庄050081 [2]河北远东通信系统工程有限公司,河北石家庄050081 [3]河北诺亚人力资源开发有限公司,河北石家庄050035

出　　处：《电子工艺技术》2016年第2期90-93,共4页Electronics Process Technology

摘　　要：LTCC厚薄膜混合基板的加工工序较多,过程复杂,层压、烧结及随后的研磨和抛光工艺对其平整度和粗糙度有较大的影响。研磨抛光后基板的清洗、烘干和溅射工艺影响金属膜层与基板的结合力等;膜层体系的选取影响基板的耐焊性;光刻及湿法刻蚀工艺影响线条精度等。通过对LTCC厚薄膜混合基板加工中的关键技术进行分析,得出加工过程中应该控制的要点。用Dupont 951和Ferro A6M材料制作的LTCC厚薄膜混合基板样件,最小线宽及间距20μm/20μm、线宽精度≤±5μm,用3M胶带测试膜层附着力满足要求,导带耐金锡共晶时间≥5 min,耐铅锡焊接时间为5次、10 s/次。Fabrication of LTCC and thin film hybrid substrate contains many procedures and is usually complex and complicated. The flatness and roughness are greatly influenced by laminating, sintering, lapping and polishing. Soldering property and fine line accuracy are separately affected by thin film system and lithography and wet etching. the key technology during LTCC and thin film hybrid substrate fabrication was analyzed in order to obtain the key points. Dupont 951 and Ferro A6 M were both used to fabricate the samples, whose minimum line width and space were 20 μm/20 μm with accuracy of ±5 μm. The adhesion was tested by 3M tape and Can meet the requirement. Soldering time during Au/Sn eutectic was more than 5 min, and soldering during Sn/Pb was more than 5 times with 10 sec per each time.

关 键 词：LTCC 厚薄膜混合基板 平整度 粗糙度 研磨抛光 湿法刻蚀 

分 类 号：TN45[电子电信—微电子学与固体电子学]