CMP设备中几种下压力施加结构简介  

The introduction about several down pressure structures of CMP tools

作　　者：周国安[1] 詹阳[1] 李伟[1] 胡兴臣 陈威[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2016年第6期45-48,共4页Equipment for Electronic Products Manufacturing

摘　　要：分析了旋转臂式结构的下压力特点,指出其采用最直接的杠杆原理,是第一代CMP机型IPEC372M的典型结构,适用于0.8μm的技术节点,并指出其局限性;后分析了桥式下压力结构,加了垂直于抛光台的主轴套及铰链结构,这种改善性的杠杆原理保证气缸施加下压力的有效性;研究了中国电子科技集团公司第四十五研究所特有专利技术的转塔式结构采用的浮动悬挂模块,能够实现完全下压力的垂直性,同时具备维持压力的恒定性和微压力的灵敏性;然后分析应用材料的旋转木马形式结构,并研究了其结构的特色能够实现抛光头的垂直下降,而且薄膜的压力完全替代下压力和背压的作用,具备更好的晶圆平坦化性能。最后指出今后CMP压力结构应该具备高响应特性、少的移动部件。First,the paper analyze the feature of down pressure in the overarm style structure,and figuring out it adoptsthe simple lever principle,which is used in the first generation CMP tool IPEC372 M,and suit for 0.8 μm technology node in the IC field.. Meanwhile the author indicates its disadvantage. Second,to introduce the bridge structure,adding the shaft sleeve and lever＇s chains which can make sure the spindle vertically to the platen. The kind of improved lever is very useful for the down pressure; Third,to study the tower structure,the patent belong to CETC 45,and it adopts the floated hanging flame,can achieve the real vertical down pressure to the platen. The tower structure has the pressure stably and very small force sensitively. Then,to analyze the carrousel structure of the AMAT＇s tool,and giving the structure＇s feature,it can apply the Membrane pressure instead of down pressure and back pressure, which realize the very excellent uniformity of the wafer. At last, pointing out the down pressure structure should has high reactive sensitively and less movement＇s parts.

关 键 词：化学机械平坦化 下压力 旋转臂 桥 转塔 旋转木马 薄膜 

分 类 号：TN305.2[电子电信—物理电子学]