多芯片陶瓷封装的结-壳热阻分析方法  

Studies on Analysis Method of Junction-to-Case Thermal Resistance of Ceramic Multi-chip Packaging

作　　者：高辉 仝良玉 蒋长顺 

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2016年第7期1-4,共4页Electronics & Packaging

摘　　要：随着半导体行业对系统高集成度、小尺寸、低成本等方面的要求,系统级封装(Si P)受到了越来越多的关注。由于多芯片的存在,Si P的散热问题更为关键,单一的热阻值不足以完整表征多芯片封装的散热特性。介绍了多芯片陶瓷封装的结-壳热阻分析方法,通过热阻矩阵来描述多芯片封装的散热特性。采用不同尺寸的专用热测试芯片制作多芯片封装样品,并分别采用有限元仿真和瞬态热阻测试方法分析此款样品的散热特性,最终获得封装的热阻矩阵。The increasing demands for higher system integration scale, smaller size andlower cost has focalized increasing public attention on system in package （SIP）. For SiP multi-chip packaging, heat dissipationis of particular importance. Single thermal resistance cannot fully represent the thermal performance of multi-chip packaging. The paper introduces the analysis method of junction-to-case thermal resistance for ceramic multi-chip packaginganddescribes the thermal characteristics using thermal resistance matrix. The test sample assembled with thermal chips of different sizes is used to obtain thermal resistance matrix usingfinite element method and transient thermal resistance test method.

关 键 词：多芯片封装 陶瓷封装 热阻 热仿真 热阻测试 

分 类 号：TN305.94[电子电信—物理电子学]