导电胶粘接元件接触电阻的稳定性研究  

Research on Stability for Contact Resistance of Electrically Conductive Adhesives with Metal Terminated Components

作　　者：肖玲[1] 何万波[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2016年第4期576-580,共5页Microelectronics

摘　　要：为解决导电胶粘接元件接触电阻不稳定的问题,研究了在温度及压力应力条件下,导电胶在不同界面的导电性和体电阻率的变化情况,分析了导电胶接触电阻不稳定的机理。试验结果表明,导电胶粘接片式元件的接触电阻的稳定性不仅与工艺加工过程有关,而且与元件端头金属基材表面金属化层的电极电动势密切相关;采用Ag基或Au基端头元件时,其导电胶粘接元件的接触电阻在粘接装配工艺过程中是最稳定的。In order to solve the problem of contact resistance shift of electrically conductive adhesives（ECA）with metal finished components,the conductivity and bulk resistivity of ECAs on various of interfaces were studied under the influence of temperature and pressure.The mechanism of contact resistance unstability was also analyzed.It was found that the stability of contact resistance was related to not only the process control,but also the electrode potential of metal terminations of the components.The contact resistance of ECAs on components with silver-based or gold-based terminations was the most stable one in the process of assembling production.

关 键 词：接触电阻 导电胶 体电阻率 

分 类 号：TN406[电子电信—微电子学与固体电子学]