光敏聚酰亚胺在硫化镉紫外器件中的应用  

Application of photosensitive polyimide in CdS ultraviolet device

作　　者：郭喜[1] 李忠贺[1] 刘佳星[1] 杨刚[1] 

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《激光与红外》2016年第9期1156-1159,共4页Laser & Infrared

摘　　要：介绍了光敏聚酰亚胺的特性及应用情况,将其引入到硫化镉紫外器件制作中,通过实验研究开发并掌握一种正性光敏聚酰亚胺的光刻工艺,亚胺化后将其作为硫化镉器件的表面钝化层,经过实验验证其粘附牢固度和光电性能满足使用要求。同时该光敏聚酰亚胺的应用能够简化近40%的制作工艺,提高了硫化镉紫外器件的生产效率和成品率。A kind of photolithography technology of positive photosensitive polyimide was introduced in the process of CdS ultraviolet device fabrication. Photosensitive polyimide can be the surface passivation of CdS ultraviolet device after imidization,and the relevant experiments were carried out. The experimental results show that this technology can meet the requirements of CdS ultraviolet device and improve the production efficiency and the yield of CdS ultraviolet device.

关 键 词：光敏聚酰亚胺 硫化镉 紫外器件 光刻 亚胺化 表面钝化 

分 类 号：TN23[电子电信—物理电子学]