一种新型PTFE覆铜板的精细图形制作前处理工艺优化  

Studies of Pretreatment Optimization of Fine Pattern Manufacture for High-Frequency PTFE Laminate

作　　者：赵丹[1] 邹嘉佳[1] 范晓春[1] 管美章[1] 

机构地区：[1]中国电子科技集团公司第38研究所,合肥230088

出　　处：《电子与封装》2017年第2期33-36,共4页Electronics & Packaging

摘　　要：精细图形制作的前处理工艺对印制电路板的铜表面粗糙度影响很大。对一款新开发的PTFE覆铜板表面采取机械磨刷、喷砂研磨、化学微蚀3种前处理工艺,通过SEM及粗糙度结果分析了处理后铜面的粗化效果。结果表明,化学微蚀前处理方式有利于获得较好的铜面外观,采用相应的图形制作工艺参数可达到较好的线宽精度要求。Pretreatment has a great impact on copper surface of printed circuit board during fine pattern manufacture process. Three types of pretreatment technologies, brush scrubbing, pumice and chemical micro-etching, are used for a novel high frequency PTFE laminate. The surface of the copper after three different pretreatments are analyzed by Scanning Electron Microscope（SEM） and Alpha-step IQ surface profiler. The results show that copper surface pretreated by chemical micro-etching is conducive to obtain better copper surface. The line width of PTFE PCB using chemical micro-etching method meets the requirement of 0.1/0.1 mm±0.020 mm.

关 键 词：高频覆铜板 前处理 图形制作 粗糙度 

分 类 号：TN405[电子电信—微电子学与固体电子学]