自动金丝键合参数的影响及其优化  

Influence and Optimization of Automatic Gold Wire Bonding Parameters

作　　者：刘波[1] 崔洪波[1] 苏海霞[1] 王腾飞[1] LIU Bo CUI Hongbo SU Haixia WANG Tengfei(The 55th Research Institute of CETC, Nanjing 210016, China)

机构地区：[1]中国电子科技集团第55研究所,江苏南京210016

出　　处：《电子工艺技术》2017年第2期102-106,共5页Electronics Process Technology

摘　　要：通过控制单一变量的试验方法,研究了金丝变形度、超声功率、超声时间和键合压力等参数对自动键合一致性和可靠性的影响,分析了每个参数对自动键合的影响规律,给出了自动键合参数的参考范围。通过正交试验方法,优化了键合参数组合,并进行试验验证。给出了不同基材自动键合的参数参考范围,对自动键合工艺具有一定的指导意义。The effects of wire deformation degree, ultrasonic power, ultrasonic time and bonding pressure and other parameters on automatic bonding consistency and reliability were studied by the test method of single variable control. The effect of each parameter on automatic bonding was analyzed. The reference range of automatic bonding parameters was given. The bonding parameters were optimized by orthogonal test, and the results were verified by experiments. The reference range of the automatic bonding of different substrates is given, which has a certain guiding significance for the automatic bonding process.

关 键 词：金丝键合 金丝变形 超声功率 键合压力 正交试验 

分 类 号：TN305[电子电信—物理电子学]