面向电子封装装备制造的若干关键技术研究及应用  

Progress and Application of Key Technologies on the Electronic Packaging Equipment Development

作　　者：陈新[1] 姜永军[1] 谭宇韬 高健[1] 杨志军[1] 刘冠峰[1] 贺云波[1] 王晗[1] 李泽湘[2] 

机构地区：[1]广东工业大学机械装备制造与控制技术教育部重点实验室,广州510006 [2]香港科技大学电子与计算机工程系,九龙999077

出　　处：《机械工程学报》2017年第5期181-189,共9页Journal of Mechanical Engineering

基　　金：国家自然科学基金(51675106;91648108);广东省科技计划(2015B010104008;2015B010104006);广东省自然科学基金(2015A030312008;2016A03030801)资助项目

摘　　要：随着电子信息产业的高速发展,高性能电子封装装备成为众多半导体器件制造企业的重大需求。我国自主精密电子封装装备的研发有待于在设计理论与方法上取得突破。针对高性能封装装备在大行程、高速、高加速度运动与高精度定位的综合性能指标方面的苛刻要求,深入开展其核心关键技术的创新设计与理论研究,提出一种解耦式高速XY并联运动平台,分析平台的工作空间及黎曼度量评价方法;针对高速轻载执行机构在其运动及定位过程中振动惯性能快速衰减难题,提出基于惯性能时空分布最优的结构优化和运动规划新方法,可有效减少执行机构末端和运动末段的能量聚积,实现高速运动条件下的快速精密定位;面向高性能封装装备对控制系统的高响应速度和精密定位精度需求,提出一种多核多任务控制器设计与驱控一体化的控制系统方案,可有效提高控制系统的实时性、可靠性和协调性;同时,开发高速精密封装装备闭环控制所需的宏微复合绝对光栅检测装置,实现高速运动过程执行机构位置信息的采集与反馈,保证高速运动过程的精密定位;同时研究键合工艺过程的劈刀运动轨迹及键合界面的冲击力影响因素。综合各项技术研究成果,成功开发出高性能引线键合机装备。As the rapid development of electronic and communication industry, high performance electronic packaging equipment has been the great demand for most semiconductor manufacturing enterprises. The research and development of precision electronic packaging equipment needs obtaining the breakthrough on the design theory and methods. Considering the restrict requests on the motion of large stroke, high speed, high acceleration with high positioning accuracy, the innovation design and theory on the kennel technologies are intensively studied, and a decoupled parallel XYmotion stage with high speed is proposed. Based on the workspace analysis and riemannian metric evaluation, the stage parameter optimization is performed. Due to the motion with a high speed and high acceleration, it is difficult to reduce rapidly the inertial energy and the vibration to the high-speed low-load mechanism. To tackle this problem, a novel structural optimization and motion planning method is proposed for precision positioning of high speed mechanism based on optimal spatial and temporal distribution of inertial energy. Considering the demands of high responding speed and positioning accuracy of the control system in packaging equipment, a control system scheme with a multi-kennel and multi-task controller and an integrated driving-controlling system are adopted, which can improve the performance of real time, reliability and coordination. In order to realize a close-loop position control for the high-speed movement, an novel linear optical encoder with absolute imaging position system is invented, which can provide the position information and feed back to the control system for the precision positioning. The capillary motion path of the bonding process and the impact force to the bonding interface are also studied. Based on these key technologies, the wire bonding machines with high performance are developed with success.

关 键 词：电子封装装备 运动平台 动力学建模 高响应运动控制 精密检测装置 

分 类 号：TH166[机械工程—机械制造及自动化] TG659[金属学及工艺—金属切削加工及机床]