LTCC与铜载板大面积软钎焊工艺研究  

Study on Large Area Soldering Process between LTCC and Cu Board

作　　者：潘玉华[1] 李杨[1] 赵少伟[1] 

机构地区：[1]中国电子科技集团公司第二十九所,四川成都610036

出　　处：《电子工艺技术》2017年第3期135-137,共3页Electronics Process Technology

摘　　要：随着电子产品向小型化和多功能化方向的不断发展,异质材料互连的需求和应用形式越来越多。从实际产品需求出发,针对LTCC陶瓷体与纯铜载板大面积底面互连需求,在无高端焊接设备前提下,摸索出一种简单易行的方法,取得较好的焊接效果,保证了产品性能的实现。这种焊接工艺方法简单可行,可重复性强,行之有效,可作为无高端设备时的一个补偿策略。With the development of electronic products to miniaturization and multi-function, the demand and joining forms between the different materials become more and more. Starting from the actual product demand, focused on large area soldering process between LTCC and Cu board, found out a simple and feasible method and got the good soldering effect under the precondition of no high-end soldering equipment. The soldering process is effective and repeatable, can be used as a compensation strategy when there is no high-end equipment.

关 键 词：小型化 LTCC 铜载板 大面积 

分 类 号：TN605[电子电信—电路与系统]