Cu/Sn/Cu界面元素的扩散行为研究现状  

Research status of element diffusion behavior in Cu/Sn/Cu interfaces

作　　者：李扬[1] 李晓延[1] 姚鹏[1] 梁晓波[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《电子元件与材料》2017年第7期17-22,共6页Electronic Components And Materials

基　　金：国家自然科学基金面上项目资助(No.51275007);国家自然科学基金面上项目资助(No.51575011);北京市自然科学基金资助(No.2162002)

摘　　要：从老化过程的界面作用和Cu/Sn/Cu界面元素扩散行为等方面,综述了国内外研究动态与进展。随后,着重介绍了老化过程Sn基钎料和Cu基板的界面反应和柯肯达尔孔洞形成的影响因素,并且柯肯达尔孔洞的形成与界面组分元素的扩散直接相关。最后指出了Cu/Sn/Cu焊点扩散行为研究中存在的问题,提出采用实验与分子动力学模拟相结合的方法开展研究,为以后界面元素扩散的研究起到启发作用。The research trend and development of interfacial diffusion at home and abroad are summarized, including interfacial effect of aging process and Cu/Sn/Cu interfacial diffusion behavior. Then, interfacial reaction between Sn based solder and Cu substrate in aging process and the influencing factors of Kirkendall void formation are introduced emphatically. Besides, Kirkendall void formation is directly related to the diffusion of interfacial component elements. Lastly, the questions existed in the diffusion behavior of Cu/Sn/Cu solder joints are pointed out, and the method of combining experiment and molecular dynamics simulation is proposed, which aims at providing further studies with inspirations.

关 键 词：Cu/Sn/Cu 扩散行为 综述 界面反应 柯肯达尔孔洞 焊点 

分 类 号：TM277[一般工业技术—材料科学与工程]