钛合金无氰碱性镀铜工艺  

Process of Cyanide-Free Alkaline Copper Plating on Titanium Alloy

作　　者：车丽媛 吴昊 夏阳[2] 

机构地区：[1]武汉奥邦表面技术有限公司,湖北武汉430032 [2]武汉理工大学,湖北武汉430010

出　　处：《电镀与环保》2017年第4期14-17,共4页Electroplating & Pollution Control

摘　　要：研究出一种钛合金无氰碱性镀铜工艺。通过实验,确定了最佳的镀液配方及工艺条件为:CuSO_4·5H_2O 25~30g/L,KOH 90~100g/L,K_2CO_3 30~50g/L,DS116添加剂110~130mL/L,pH值9.0~10.5,电流密度0.5~4.0A/dm^2,温度40~60℃。同时,对镀层和镀液的性能进行了测试。The process of cyanide-free alkaline copper plating on titanium alloy was oevelopeo. The optimum plating solution formula and technological conditions, which were determined by experiment, were as follows- CuSO4-5H2O 25-30 g/L, KOH 90-100 g/L, K2CO3 30-50 g/L, DS116 additive 110-130 mL/L, pH value 9.0-10.5, current density 0.5-4.0 A/dm2 , temperature 40-60 ℃. Meanwhile, the performances of the coating and plating solution were tested.

关 键 词：无氰 碱性镀铜 钛合金 镀液成分 工艺条件 

分 类 号：TQ153[化学工程—电化学工业]