协同分析在集成电路失效定位中的应用探讨  

Application of Collaborative Analysis in Failure Location of Integrated Circuits

作　　者：虞勇坚[1] 邹巧云[1] 吕栋[1] 陆坚[1] 

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2017年第8期36-40,48,共6页Electronics & Packaging

摘　　要：随着集成电路规模和制造工艺的发展,对失效电路进行失效点定位的难度也越来越大,单独依靠一种分析方法很难实现失效点定位。利用先进分析仪器设备,采用多种方法协同分析,成为针对大规模集成电路失效定位分析的必然选择。从有效实现失效定位为出发点,根据失效分析的标准和流程,将定位分析过程和设备仪器划分成三个层次,结合在各分析阶段发现的失效案例,说明多种分析方式协同使用可以实现大规模集成电路失效点的快速、准确定位,分析过程中获取的信息可以为后续的失效机理和失效原因分析提供可靠依据。With the development of integrated circuit scale and manufacturing process, it is difficult to locate the failure point of failure circuits. Single analysis method may not obtain the expected result. Advanced analytical instruments and devices and multiple methods of collaborative analysis become inevitable choices for failure location analysis of large-scale integrated circuits. According to the failure analysis standards and process, equipment is divided into three levels. Various failure cases found in each analysis stage show that the multi-analysis method is conducive to achieve fast and accurate positioning of large-scale integrated circuit failure points. The analysis obtained during the process provides reliable reference for further failure analysis.

关 键 词：集成电路 失效分析 协同分析 失效定位 

分 类 号：TN407[电子电信—微电子学与固体电子学]