热压烧结靶材制备氧化铟锌薄膜晶体管  

Preparation of Indium-Zinc-Oxide Thin Film Transistors by Hot-Pressing Sintering Target

作　　者：宋二龙 兰林锋[1] 林振国[1] 孙圣[1] 宋威[1] 李育智[1] 高沛雄 张鹏[1] 彭俊彪[1] 

机构地区：[1]华南理工大学发光材料与器件国家重点实验室,广州510640

出　　处：《物理化学学报》2017年第10期2092-2098,共7页Acta Physico-Chimica Sinica

基　　金：国家重点研发计划(2016YFB0401105);国家自然科学基金(61204087);广州市珠江科技新星(2014J2200053);广东省科技计划(20158090914003)资助项目~~

摘　　要：本文研究了热压烧结条件对氧化铟锌(IZO)靶材和薄膜晶体管(TFT)性能的影响。以80%:20%(质量分数比)的ZnO和In_2O_3的混合粉体为原料通过热压烧结法制备IZO靶材,以制备的靶材通过磁控溅射制备IZO TFT。X射线衍射(XRD)图谱以及扫描电镜(SEM)图像表明IZO靶材结晶性好,元素分布均匀。烧结温度为850℃时靶材呈现烧结致密化,900℃-60 min条件下In_2O_3的挥发破坏了靶材烧结致密化。提高烧结温度或延长烧结时间加速In向ZnO晶格的扩散以及空位向表面迁移,有利于靶材致密化以及形成InZnO_x晶相。TFT器件表征结果表明低密度和过高密度靶材会恶化薄膜质量,降低器件性能,可见适当高密度的靶材对制备TFT至关重要,最终900℃-90 min条件的靶材所制备的TFT性能最好,迁移率为16.25 cm^2·V^(-1)·s^(-1)。The sintering condition was studied how to influence the performance of indium-zinc-oxide （IZO） target and thin film transistor （TFT） in this paper. IZO targets was prepared by hot-pressing sintering using mixed power （20% （w, mass fraction） In203）, then fabricated TFT with above sintering targets. X-ray diffraction （XRD） patterns ＆ scanning electron microscopy （SEM） images showed targets had good crystallinity and elements were uniformly distributed. The target was typical densification process with sintering temperature of 850 ℃. The volatilization of Jn203 undermined the densification of the target, with condition of 900 ℃-60 min. It can be seen that increase of sintering temperature and elongation of preserving time could inhibit the In203 volatilization, facilitated the sintering densification of IZO target and formed the InZnOx crystal phase, thereby increased the density of the target. IZO TFTs＇ performance showed the sputtering deteriorates the film quality with low-density target, and the grain of the high-density target was slightly abnormal, which resulted in deterioration of the film uniformity, all reduced the performance of TFT. Therefore, anappropriate high-density target was essential for the preparation of IZO-TFT.

关 键 词：薄膜晶体管 氧化铟锌 热压烧结 靶材 磁控溅射 

分 类 号：TB383.2[一般工业技术—材料科学与工程] TN321.5[电子电信—物理电子学]