MLCC叠层空洞判别超声检测技术研究  

Research on the Ultrasonic Testing Technology for the Discrimination of MLCC Laminated Void

作　　者：刘磊[1] 卢思佳[1] 周帅[1] 王斌[1] LIU Lei LU Sijia ZHOU Shuai WANG Bin(CEPREI, Guangzhou 510610, China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2017年第5期30-34,共5页Electronic Product Reliability and Environmental Testing

摘　　要：通过对超声检测技术的原理进行分析,并将其与X射线检查和制样镜检技术分别进行对比,阐述了超声检测技术在检测片式多层瓷介电容器(MLCC)的裂纹、分层和空洞等内部缺陷方面的优势。对超声显微镜的扫描原理和扫描模式进行分析,确定了MLCC内部空洞缺陷超声检测的判定方法。并利用B扫描模式对MLCC的叠层空洞进行了判别和区分,对于提高MLCC超声检测技术检测结果的准确性具有指导意义。By analyzing the principle of ultrasonic testing technology and comparing it with X- ray inspection and sample preparation microscopy techniques respectively, the advantages of ultrasonic testing technology in detecting the internal defects of crack, delamination and void of MLCC are described. Through the analysis of the scanning principle and scanning modes of the ultrasonic microscope, the decision method of the ultrasonic testing for the internal void defect of MLCC is determined. And the B-scan mode is used to discriminate and distinguish the laminated void, which is of great significance to improve the accuracy of the test results of MLCC ultrasonic testing technology.

关 键 词：片式多层瓷介电容器 超声检测技术 内部缺陷 叠层空洞 扫描模式 

分 类 号：TB559[理学—物理] TM534.1[理学—声学]