Sn-9Zn/Cu 焊点界面反应及其化合物生长行为  

Application of electrical engineering materials in magnetic coupling and resonant wireless power transfer technology

作　　者：李双 胡小武[1] 徐涛[1] 李玉龙[1] 江雄心[1] 

机构地区：[1]南昌大学机电工程学院,江西南昌330031

出　　处：《电子元件与材料》2017年第11期1-11,共11页Electronic Components And Materials

基　　金：国家自然科学基金资助项目（No.51465039; No.51765040）; 江西省自然科学基金资助项目（No.20151BAB206041; No.20161BAB206122）

摘　　要：通过扫描电镜（SEM）等手段研究了Sn-9Zn/Cu在不同浸焊时间与时效时间等条件下的界面反应及其金属间化合物（IMC）生长行为。结果表明：在浸焊后,Sn-9Zn/Cu钎焊接头界面形成了扇贝状的界面化合物Cu5Zn8,IMC层厚度随着浸焊时间与时效处理时间的增加而增加,未时效处理的焊点界面IMC与铜基板接触的一面较为平直,而与钎料接触的一侧呈现出锯齿状,随着时效时间的增加,界面变得越来越不平整;另外在IMC层与焊料之间产生裂缝现象,分析认为是由于钎料与IMC之间的热膨胀系数差异导致热应力形成裂缝。浸焊600 s后的试样在时效15 d后IMC层与Cu基板接触侧产生了与初始金属间化合物Cu5Zn8不同的三元化合物Cu6（Sn,Zn）5。The magnetic coupling and resonant wireless power transfer （WPT） technology is the most advanced technology, that combines application and research. These subjects include the electromagnetic field, high-frequency power and electron technology and electric engineering material, etc. The main principles of resonant wireless power transfer technology are introduced and the research levels are discussed. New progresses are discussed on the electrical engineering materials used in magnetic coupling and resonant wireless power transfer system. The discussion is focused on the current research status and the development trend of the superconductor materials and metamaterials in the wireless power transfer system. Besides, this paper prospects the promotion and optimization on the magnetic coupling and resonant wireless power transfer system by the development of electric engineering materials.

关 键 词：Sn-9Zn/Cu系 无铅钎料 界面反应 IMC 时效 Cu6(Sn Zn)5 

分 类 号：TM24[一般工业技术—材料科学与工程] TM26[电气工程—电工理论与新技术]