全自动磁控溅射镀膜设备及工艺的研究  

Research of Equipment and Technology by Automatic Magnetron Sputtering Coating

作　　者：毛朝斌 佘鹏程 范江华 罗超 陈特超 

机构地区：[1]中国电子科技集团公司第四十八研究所,湖南长沙410111

出　　处：《电子工业专用设备》2018年第1期21-24,共4页Equipment for Electronic Products Manufacturing

摘　　要：溅射镀膜作为薄膜混合集成电路的重要环节,在厂商要求保证工艺质量的前提下,希望提高设备的自动化程度,减少靶间污染。介绍了一种用于磁控溅射镀膜设备,着重介绍了该系统关键部件溅射镀膜腔室和真空机械手腔室;该系统结构简单,控制效果良好,通过对工艺的研究,该系统能满足生产线的生产要求。The system of sputtering coating as an important link of the thin film hybrid integrated circuit.The manufacturers in the requirements under the premise of guarantee the quality of process,hope to improve equipment automation degree,reduce pollution between target. The magnetron sputtering coating equipment has been introduced in this paper. The system of key parts sputtering coating chamber and ROBOT of vacuum chamber has been introduced emphasis in this paper. This system is simple in structure and good control offect.It can satisfy production requirements for the productivity.

关 键 词：磁控溅射 磁控溅射靶 机械手 

分 类 号：TN305[电子电信—物理电子学]