一种提高抗过载能力的圆片级真空封装  

A Wafer-Level Vacuum Packaging for Improving Overload Resitance

作　　者：赵永祺 石云波[1] 赵思晗 焦静静 李飞 王彦林 Zhao Yongqi;Shi Yunbo;Zhao Sihan;Jiao Jingjing;Li Fei;Wang Yanlin(National Key Laboratory for Electronic Measurement Technology,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学电子测试技术国家重点实验室

出　　处：《微纳电子技术》2018年第11期844-848,共5页Micronanoelectronic Technology

基　　金：国家自然科学基金青年科学基金资助项目(51705477);电子测试技术重点实验室稳定支持经费资助项目(WD614200104011804)

摘　　要：为提高现有的MEMS高量程压阻式加速度传感器的抗过载能力,优化设计了一种新型圆片级封装结构。通过在敏感结构上增加防护层阻挡质量块位移来减小悬臂梁根部应力,从而防止其断裂,提高了传感器的抗过载和循环使用的能力。针对这一封装设计了一种后释放悬臂梁的加工工艺,减小了封装对悬臂梁的影响,通过抛光和阳极键合工艺实现真空封装,仿真分析封装前后传感器的固有频率和等效应力。结果表明该封装对加速度计的固有频率基本无影响,而抗过载能力提高了两倍以上,说明所设计的圆片级封装结构可以有效提高该类加速度传感器的抗过载能力。In order to improve the overload resistance of the existing MEMS high-range piezoresistive acceleration sensors,a new type of wafer-level packaging structure was optimized and designed.By increasing the protective layer on the sensitive structure to block the mass displacement,the stress of the cantilever beam root was reduced to prevent it from breaking,and the overload resistance and recycling performance of the sensor were improved.A post-release cantilever beam machining process was designed for this package to reduce the impact of the package on the cantilever beam.The vacuum packaging was achieved through polishing and anodic bonding processes.The natural frequency and equivalent stress of the sensor before and after packaging were simulated and analyzed.The results show that the packaging basically has no effect on the natural frequency of the accelerometer and the overload resistance increases more than two times,showing that the designed wafer-level packaging structure can effectively improve the overload resistance of the accelerometer.

关 键 词：圆片级封装 抛光 阳极键合 真空封装 抗过载 

分 类 号：TN305.94[电子电信—物理电子学]