改善键合强度分布,提高器件可靠性——键合设备的影响  

Increase Device′s Reliability by Improving Distribution of Bonding Strength --the Effect of Bonding Machine

作　　者：吴燕[1] 陈台琼[1] 汤旭东[1] 

机构地区：[1]四川压电与声光技术研究所,重庆400060

出　　处：《压电与声光》2002年第5期398-400,共3页Piezoelectrics & Acoustooptics

摘　　要：DPA试验中 ,键合强度值的大小是判断器件合格与否的一个定量标准 ,而键合强度值的分布状态则是影响器件在应用中的可靠性的重要因素之一。该文通过对大量试验数据的分析 ,指出键合设备对键合强度值分布状况的影响 ,并提出了改善键合强值分布状况的措施 ,以提高器件 ,特别是军品器件的可靠性 ,使其能完全满足DPA试验要求。In destructive physical analysis(DPA) testing,the value of bonding strength is one quantitative standard by which we say if a group of devices is ok.We also know that the distribution of bonding strength is one of the important factors affecting device′s reliability in applying.By analysis large amounts of testing data,this paper indicate the effect of bonding strength causeed by bonding machine and give some suggestions to improve the distribution to increase the reliability of devices,especially those for military use.So that they can completely meet the demands of DPA tesing.

关 键 词：键合设备 键合强度 分布 可靠性 破坏性物理分析 DPA 

分 类 号：TN406[电子电信—微电子学与固体电子学]