倒装芯片组装集成电路开封方法  

Unsealing methods of flip chip assembly integrated circuit

作　　者：周帅[1] 郑大勇[1] 王斌[1] ZHOU Shuai;ZHENG Dayong;WANG Bin(China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, Guangdong 510610, China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《太赫兹科学与电子信息学报》2017年第2期328-332,共5页Journal of Terahertz Science and Electronic Information Technology

基　　金：广东省自然科学基金资助项目(2015A030310331;2015A030306002)

摘　　要：倒装芯片组装集成电路的结构与常规封装不同,导致现行开封技术不完全适用于倒装芯片组装集成电路。对不同封装形式的倒装芯片组装集成电路结构分析,找出目前制约开封技术的关键因素。以陶瓷及塑封封装倒装芯片组装集成电路为例,运用热风枪、高温预处理、机械应力及化学腐蚀等方法,提出了一套适用性强、效率高的综合性倒装芯片组装集成电路开封工艺技术,并通过实例进行验证和总结。通过运用该技术可以有效解决倒装芯片组装集成电路的开封问题,为后续标准的修订及破坏性物理分析提供依据和帮助。The structure of flip chip assembly integrated circuit is different from conventional packaging,which brings that the current unsealing technology is not completely suitable for flip chip assembly integrated circuit.After analyzing the structures of flip chip assembly integrated circuits with different packaging forms,key factors which restrict the present unsealing technology can be found out.Taking ceramic and plastic sealed packaging flip chip assembly integrated circuits as examples,applying methods such as the heat gun,pretreatment under high temperature,mechanical stress and chemical corrosion,a set of comprehensive flip chip assembly integrated circuit unsealing technology with strong applicability and high efficiency is put forward.In addition,living examples are used for validation and conclusion.This technology can effectively solve the unsealing problem of flip chip assembly integrated circuit and provide basis and help for the subsequent revision of the standard and the destructive physical analysis.

关 键 词：倒装芯片 结构分析 封装形式 环氧树脂 开封方法 

分 类 号：TN405[电子电信—微电子学与固体电子学]