3D封装中电镀参数对微凸点制备的影响  

Effects of plating parameters on fabrication of micro-bump in 3-D integration

作　　者：梁晓波[1] 李晓延[1] 姚鹏[1] 李扬[1] 金凤阳 LIANG Xiaobo;LI Xiaoyan;YAO Peng;LI Yang;JIN Fengyang(The Key Laboratory of Advanced Functional Materials of Ministry of Education, School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China)

机构地区：[1]北京工业大学材料科学与工程学院,新型功能材料教育部重点实验室,北京100124

出　　处：《电子元件与材料》2017年第5期37-43,共7页Electronic Components And Materials

基　　金：国家自然科学基金面上项目资助(No.51575011);北京市自然科学基金资助(No.2162002)

摘　　要：电子信息技术对封装焊点提出了高密度、高质量、小尺寸、低成本的要求,在此基础上,由二维平面到三维高度上的封装技术应运而生。微凸点的制备是3D封装中非常重要的一个环节。本文通过酸性环境电镀的方法在Cu基板沉积微米级别的Sn层,通过扫描电子显微镜和原子力显微镜观察不同参数下镀层的表面状态,研究分析了电镀参数对镀层表面的影响规律,并得到了不同电镀时间与镀层厚度的关系。最终得到制备质量较高Sn层的最优电镀参数为:硫酸浓度160 g/L,环境温度25℃,电流密度为1 A/dm^2。通过金相法及台阶仪测试法分别测量不同电镀时间镀层的厚度可知,镀层厚度与电镀时间呈正比。Electronic information technology proposed high density,high quality,small size and low cost requirements on packaging joints.Therefore,3-D packaging technology appeared.The fabrication of micro-bump is very important for3-D packaging.In this study,electroplating was used to deposited micro-level Sn layer on the Cu substrate and the surface condition of Sn layer in different parameters were observed by SEM and AFM to analyze the influence law of plating parameters on the surface of Sn layer.In addition,the relationship between electroplating time and plating thickness was obtained.The results show optimal parameters for fabricating high quality Sn layer are:H2SO4of160g/L,environment temperature of25℃,current density of1A/dm2.The thickness of plating layer is proportional to the plating time.

关 键 词：3D封装 微凸点 酸性电镀 电镀参数 表面状态 镀层厚度 

分 类 号：TN406[电子电信—微电子学与固体电子学]