系统级封装技术研究领域及应用  

Research andApplication of System-in Package Technology

作　　者：刘全威[1] 王珂 张崎[1] LIU Quan-wei;WANG Ke;ZHANG Qi(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2018年第3期70-74,共5页Hybrid Microelectronics Technology

摘　　要：系统级封装(SiP,System-in-Package)显著区别于传统电子封装,它更强调在单个封装单元中,通过三维立体集成与微组装工艺,实现系统或子系统的功能。从研发模式上看,它既具有系统与器件协同设计,又可在即有的器件、系统等基础上,采用三维立体封装的异构/异质的集成手段来实现,比较适合我们在现有军事电子工业能力基础上赶超世界先进水平。只要措施得当,就完全可能在军用电子系统方面实现局部突破,在较短时间内提升武器装备的信息化水平,且推动整个电子制造业的技术进步。本文结合一些案例,介绍系统级封装技术主要涉及的研发方面。System-in-Package technology is significantly different from the conventional electronic packaging technology,it is more emphasis that through three-dimensional integrate and micro-assembly process,implement the functions of a system or subsystem in a single packaging unit.From the perspective of R&D model,it has both cooperative design of system and device,but also can be independently processed by isomeric/heterogeneous integrated technology.Its more suitable to catch up with the worlds advanced levels based on the industrial capability of current military electronics.As long as the measures are taken properly,it is entirely possible to achieve partial breakthroughs in military electronic systems,improve the information level of weapons and equipment in a relatively short period of time,and promote technological advancement in the entire electronics manufacturing industry.This article combines some cases to introduce the research and development aspects of system-in-package technology.

关 键 词：系统级封装 微纳尺度 三维集成 集成封装 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN305.94