传统SAW离子束调频技术研究  

Ion Beam Trimming Technology for Conventional SAW

作　　者：伍平[1] 陈峻[1] 米佳[1] 董家和 赵雪梅[1] 刘晓莉[1] 董姝[1] 黎亮[1] WU Ping;CHEN Jun;MI Jia;DONG Jiahe;ZHAO Xuemei;LIU Xiaoli;DONG Shu;LI Liang(The 26th Institute of China Electronics Technology Group Corpaoration,Chongqing 400060,China)

机构地区：[1]中国电子科技集团公司第二十六研究所

出　　处：《压电与声光》2019年第6期874-876,共3页Piezoelectrics & Acoustooptics

摘　　要：制作传统声表面波(SAW)器件晶圆芯片表面的材料是Al,Al在空气中被氧化,极易生成致密的氧化铝(Al2O3)薄膜,由于Al2O3薄膜和Al及基底压电材料的刻蚀速率存在差异,会导致SAW的离子束调频过程复杂。该文介绍了一种用于SAW的离子束调频方法,采用该方法对制作的SAW器件进行离子束调频后,实现了目标频率的调高和调低,并进一步提高了频率集中度,从而解决了低频窄带SAW器件及2 GHz以上SAW高频器件频率精度难以提高的工艺难题。The surface material for fabricating conventional SAW wafer is Al,which is oxidized in air,and it is easy to form a dense aluminum oxide(Al2O3)film.Due to the difference of etching rate among the aluminum oxide(Al2O3)film,Al and the substrate piezoelectric material,it results in complexity of the ion beam trimming process.An ion beam trimming method for SAW devices is introduced in this paper.By using this method,the target frequency of SAW devices can be adjusted up and down,and the frequency concentration can be further improved,so that the process problem that it is difficult to improve the frequency accuracy of low-frequency narrow-band SAW devices and SAW high-frequency devices above 2 GHz is solved.

关 键 词：离子束 刻蚀速率 目标频率 

分 类 号：TN65[电子电信—电路与系统]