圆片等离子划片工艺及其优势  

Wafer Plasma Dicing Technology and Its Advantages

作　　者：肖汉武 XIAO Hanwu(Wuxi ZhongWei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司

出　　处：《电子与封装》2020年第2期8-12,共5页Electronics & Packaging

摘　　要：等离子划片是近年来兴起的一项新型圆片划片工艺。与传统的刀片划片、激光划片等工艺不同,该工艺技术可以同步完成一张圆片上所有芯片的划片,生产效率明显提升,是对现有划片工艺的一个颠覆。介绍了圆片划片工艺的工作原理、技术特点及其优势,并对其在解决圆片划片应用中的典型问题和不足之处进行了讨论。Plasma dicing is a new raised technology for wafer dicing in recent years,diflfering from traditional blade dicing,laser dicing and other dicing technologies,this new technology could complete the whole dicing process of all dice in one wafer synchronously,benefited with a large increasing on process efficiency.It is a disruptive technology to existing dicing process.This paper introduces the working principle,technical features and its advantages,and the typical issues in wafer dicing which are solved by plasma dicing,and its application disadvantages are also discussed.

关 键 词：等离子刻蚀 等离子划片 刀片划片 激光划片 多项目圆片 

分 类 号：TN305.1[电子电信—物理电子学]