基于一体化封装的小型化设计与实现  

Miniaturization Design and Implementation Based on Integral Substrate Packaging

作　　者：唐可然[1] 徐祯[1] 杨帆[1] 陈永任[1] 李文龙 TANG Keran;XU Zhen;YANG Fan;CHEN Yongren;LI Wenlong(No.24 Research Institute of CETC,Chongqing 400060,China)

机构地区：[1]中国电子科技集团公司第二十四研究所

出　　处：《电子与封装》2020年第2期19-23,共5页Electronics & Packaging

摘　　要：以一个幅度调制器模块的小型化需求为例,基于一体化封装技术,设计构造出一种小型化封装结构,并详细介绍了该结构的外形特点与材料特性。利用这种封装结构对原模块电路进行小型化设计,外形尺寸可由91 mm×28 mm×8.5 mm减小为20 mm×15 mm×7.6 mm,平面布版面积缩小约88%。利用多芯片组装(MCM)和表面组装(SMT)工艺,组装实现了小型化电路,实测其电参数指标与原电路基本一致,成功达到了小型化目的。According to the miniaturization requirement of an amplitude modulator module,a miniaturization packaging structure is designed based on the integral substrate packaging technology.Shape and material characteristics of the structure are introduced in detail.This kind of packaging structure is used to miniaturized the amplitude modulator,as the size is changed from 91 mm×28 mm×8.5 mm to 20 mm×15 mm×7.6 mm,and the plane area is reduced about 88%.The miniaturization circuit is realized by common multi-chip module(MCM)technology and surface mount technology(SMT),which successfully achieve the purpose of miniaturization,because of the almost same parameters with the modulator.

关 键 词：小型化 一体化封装 多芯片组装 

分 类 号：TN305.94[电子电信—物理电子学]