阳极键合在MEMS封装中的研究进展  

Development of Anodic Bonding in MEMS Packaging

作　　者：刘海波 梁晓波 刘冠华 柴国明 黄漫国 LIU Hai-bo;LIANG Xiao-bo;LIU Guan-hua;CHAI Guo-ming;HUANG Man-guo(Military Representative Office of Equipment Department of the PLA Navy in Xianyang Area,Xianyang 713100,China;AVIC Beijing Changcheng Aeronautical Measurement and Control Technology Research Institute,Beijing 101111,China;Aviation Key Laboratory of Science and Technology on Special Condition Monitoring Sensor Technology,Beijing 100022,China)

机构地区：[1]海军装备部驻咸阳地区军事代表室,陕西咸阳713100 [2]中国航空工业集团公司北京长城航空测控技术研究所,北京101111 [3]状态监测特种传感技术航空科技重点实验室,北京101111

出　　处：《测控技术》2020年第5期69-74,共6页Measurement & Control Technology

摘　　要：在微电子机械系统(Micro Electro Mechanical Systems,MEMS)领域,阳极键合是应用最为广泛的一项技术,有着广阔的发展前景。表面预处理和键合工艺是阳极键合中最为重要的两个因素。介绍了近年来在表面预处理和键合工艺方面的研究进展,分析总结了该技术的研制情况,指明了现阶段表面预处理和阳极键合存在的问题以及未来的研究方向。Anodic bonding is widely used in the field of MEMS( Micro Electro Mechanical Systems) and has broad prospects. The two most important factors of surface pretreatment and bonding process in anodic bonding technology are studied,and their research progresses are analyzed and summarized,the current problems and the future research directions are indicated.

关 键 词：微机电系统 封装 表面处理 阳极键合 

分 类 号：TN605[电子电信—电路与系统]