化学镍钯金镀层的PCB组装质量与可靠性控制  

Assembly Quality and Reliability Control of ENEPIG Finish PCB

作　　者：王志会[1] 徐达[1] 魏少伟 冯志宽 WANG Zhihui;XU Da;WEI Shaowei;FENG Zhikuan(The 13rd Research Institute of CETC,Shijiazhuang 050020,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050020

出　　处：《电子工艺技术》2020年第2期87-90,共4页Electronics Process Technology

摘　　要：PCB化学镍钯金(ENEPIG)镀层能同时满足表面贴装,导电胶粘接,金丝/铝丝键合等工艺要求,在微组装工艺应用日趋广泛。研究了在微组装工艺中,化学镍钯金PCB在金丝键合和焊点可靠性方面出现的工艺质量问题,分析了影响工艺可靠性的机理和原因,提出了该工艺可靠性控制的措施。With electroless Ni electroless Pd immersion Au(ENEPIG)fi nish,PCB can meet the technical requirements of SMT,conductive adhesive bonding,Au-wire/Al-wire bonding.Therefore,ENEPIG finish is widely applied in micro-assembly techniques.In micro assembly process,the quality problems in wire bonding and solder joint reliability of the PCB are studied,The wire bonding and soldering reliability are focused on micro-assembly techniques,and mechanisms are analysed in depth.In the end,the the control measures for ENEPIG fi nish are put forward.

关 键 词：PCB 化学镍钯金 微组装 金丝键合 BGA 

分 类 号：TN605[电子电信—电路与系统]