回流焊炉温曲线的管控分析  

Management and Control Analysis of Reflow Soldering Furnace Temperature Curve

作　　者：汤宗健[1] 谢炳堂 梁革英[1] Tang Zong-jian;Xie Bing-tang;Liang Ge-ying(College of Mathematics and Information Science,Guangxi University,Guangxi Nanning 530004;Nanning Fugui Precision Industrial Co.,Ltd,Guangxi Nanning 530031)

机构地区：[1]广西大学数学与信息科学学院,广西南宁530004 [2]南宁富桂精密工业有限公司,广西南宁530031

出　　处：《电子质量》2020年第8期15-19,23,共6页Electronics Quality

基　　金：广西重点研发计划项目"全息电子工业制程云数据分析平台"(2017AB19031);广西高等教育本科教学改革工程项目"信息管理与信息系统专业'互联网+'能力培养的研究与实践"(2016JGB125);"基于校企互动的《IT项目管理》课程MOOC建设与研究"(2018GJB107)。

摘　　要：回流焊温度曲线记录印刷电路板元件焊接过程的温度变化,是元件焊接质量的主要影响因素。针对用测温板获取回流焊温度曲线的影响因素,对测温流程进行潜在失效效应分析,发现利用测温板频繁进行炉温测试具有较高的风险系数。但通过对回焊炉各温区温度的监控与分析,发现回焊炉的制程能力处于优良状态,潜在失效效应的风险系数较低。研究表明,在获取可靠的炉温曲线后,只需要加强炉温监控即可保证焊接质量。Reflow soldering temperature curve records the temperature change during the soldering process of printed circuit board components,which is the main influencing factor of component welding quality.According to the influence factors of temperature curve of reflow soldering obtained by using temperature measuring plate,we analyzed the potential failure effects of the temperature measurement process,and found that using the temperature plate to test the furnace temperature frequently has a high risk priority number.But by monitoring and analyzing the temperature of each temperature zone of the reflow furnace,we found that the process capability of the reflow furnace is excellent and the risk priority number of potential failure effects is low.The research shows that:after obtaining reliable furnace temperature curve,the soldering quality can be guaranteed only by strengthening furnace temperature monitoring.

关 键 词：回流焊 炉温曲线 潜在失效效应分析 制程能力 

分 类 号：TN405[电子电信—微电子学与固体电子学] TG456[金属学及工艺—焊接]