混合集成电路封装腔体中多余物的控制研究  

Research on Reminder Particles Control of Packaging Cavity in Hybrid Integrated Circuit

作　　者：左凤娟 周婷[1] 朱仁贤 曾辉[1] 王腾[1] ZUO Feng-juan;ZHOU Ting;ZHU Ren-xian;ZENG Hui;WANG Teng(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088

出　　处：《混合微电子技术》2020年第2期52-59,共8页Hybrid Microelectronics Technology

摘　　要：混合集成电路封装腔体内的多余物是影响其可靠性的重要因素之一,本文阐述了现有多余物检测手段及其局限性,分析了封装腔体内多余物的来源,通过对工艺组装过程多余物引入的预防和控制,有效控制混合集成电路封装腔体内多余物。同时,结合混合集成电路发展的新需求,在现有的多余物处理手段和固定方式上进一步研究,有效提高多余物处理效果和效率,最终提高混合集成电路颗粒碰撞噪声检测(PIND)合格率以及产品的可靠性。The reminder particles of packaging cavity in hybrid integrated circuit are one of the important factors affecting its reliability.In this paper,detection method and its limitation of remainder particles are described,the origin of the reminder particles in the packaging cavity is analyzed.Through the prevention and the control of the process assembly,the reminder particles can be effectively controlled.At the same time,in combination with the new requirements of hybrid integrated circuit development,further research on existing reminder particles disposal methods and fixing methods are performed.So the effect and efficiency can be effectively improved.Finally,the quality rate of hybrid integrated circuit PIND(particle impact noise detection)and reliability of products are also improved.

关 键 词：混合集成电路 多余物 控制 可靠性 

分 类 号：TN45[电子电信—微电子学与固体电子学] TN406