气密性平行缝焊盐雾腐蚀机理研究  

Study on Salt Spray Corrosion Mechanism of Hermetic Parallel Seam Welding

作　　者：颜炎洪 徐衡 王成迁 YAN Yanhong;XU Heng;WANG Chengqian(China Key System&Integrated Circuit Co,Ltd,Wuxi 214072,China)

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072

出　　处：《电子与封装》2020年第11期9-13,共5页Electronics & Packaging

摘　　要：平行缝焊是一种具有低热应力、高可靠性的气密封装,是微电子器件最常用的气密性封装方法之一。在一些特殊环境条件下使用的电子元器件,需要运用平行缝焊技术进行气密性封装,以防止器件中的电路因腐蚀气氛的浸蚀引起气密性失效。通过扫描电镜(SEM)、能谱分析(EDS)、金相分析、晶态分析等测试手段,从微观角度系统性地探究平行缝焊封装后盖板出现盐雾腐蚀失效的机理。研究表明,表面镀层由非晶态转变为晶态、失去非晶态保护膜和镀层形成裂缝、在盐雾环境下发生电化学腐蚀是气密性平行缝焊盐雾腐蚀的根本原因。分析并给出解决方案,为提高生产中产品的封装质量提供理论依据,具有一定的指导意义。Parallel seam welding is a kind of hermetic package with low thermal stress and high reliability.It is one of the most frequently-used air-tight packaging methods for microelectronic devices.Electronic components used in some special environmental conditions need to be airtight sealed by parallel seam welding technology to prevent the circuit in the device from air tightness failure due to corrosion of the atmosphere.In this paper,the mechanism of salt spray corrosion failure of parallel welded package rear cover was systematically investigated from the microscopic perspective by means of scanning electron microscopy(SEM),energy dispersive spectrometer(EDS),metallographic analysis,and crystal analysis.The results show that the fundamental reason,why electrochemical corrosion occurs in air tight parallel seam welding under the environment of salt and spray,exists in that the surface coating changes from amorphous state to crystalline state and loses its amorphous protective film and the coating,which develops cracks.Hence,it has a certain guiding value and significance to analysis and give birth to a solution,which can provide a theoretical basis to improve the packaging quality of products in production.

关 键 词：气密性封装 平行缝焊 盐雾腐蚀 盖板 微观组织 

分 类 号：TN305.94[电子电信—物理电子学]