基于X射线图像的LED芯片邦定线断裂缺陷的自动检测方法研究  

Research on automatic method of detecting LED chip bonding line fracture with X-ray image

作　　者：王言 卢军[1] Wang Yan;Lu Jun(College of Mechanical and Electrical Engineering,Shaanxi University of Science and Technology,Xi’an,Shannxi 710021,China)

机构地区：[1]陕西科技大学机电工程学院,陕西西安710021

出　　处：《计算机时代》2021年第1期21-24,共4页Computer Era

基　　金：陕西省科技厅工业攻关项目(2016GY-049)。

摘　　要：在使用工业X射线设备检测LED芯片邦定线的邦定质量时,为了自动检测出邦定线是否断裂,提出采用自适应阈值分割与漫水填充相结合的方法。步骤如下:首先根据邦定线在X射线图像中的特点,采用自适应阈值分割出邦定线焊点所在位置,并识别其质心;再对原始射线图像采用拉普拉斯算子进行图像锐化,增强图像的灰度跳变部分;然后以焊点质心为种子点,采用漫水填充法完整分割出邦定线;最终根据分割出的连通域与焊点质心的包含关系判断出邦定线断裂的情况。When using industrial X-ray equipment to detect the bonding quality of LED chip bonding line,in order to automatically detect whether the bonding line is broken,a method combined adaptive threshold segmentation with Flood Fill is proposed.The steps are as follows:firstly,according to the characteristics of bonding line in X-ray image,adaptive threshold is used to segment the position of bonding line solder joint and identify its centroid;secondly,Laplacian operator is used to sharpen the original ray image to enhance the gray jumping part of the image;then,the solder joint centroid is taken as the seed point,and Flood Fill method is used to completely segment the bonding line;finally,according to the inclusion relationship between the segmented connected domain and the solder joint centroid,the fracture situation of the bonding line can be judged.

关 键 词：邦定线断裂检测 图像分割 漫水填充 拉普拉斯算子 

分 类 号：TP391.41[自动化与计算机技术—计算机应用技术]