高密度封装中互连结构差分串扰建模与分析  

Modeling and Analysis of Differential Crosstalk of Interconnect Structure in High Density Packaging

作　　者：宣慧 于政 吴华 丁万春 高国华 XUAN Hui;YU Zheng;WU Hua;DING Wanchun;GAO Guohua(Tongfu Microelectronics Co.Ltd.Nantong,Nantong 226000,China)

机构地区：[1]通富微电子股份有限公司,江苏南通226000

出　　处：《电子与封装》2021年第2期68-71,共4页Electronics & Packaging

摘　　要：针对传统模型存在较大分析误差的问题,提出高密度封装中互连结构差分串扰建模与分析。在对互连结构差分传输线耦合关系分析的基础上,建立了四线差分结构串扰模型。运用该模型对互连结构差分串扰中的电阻、电容以及电感进行等效分析,解决高密度封装中互连结构差分串扰问题。经试验证明,此次建立模型平均误差为0.042,满足抑制高密度封装中互连结构差分串扰问题的精度需求。In view of large analysis errors in the traditional model,modeling and analysis of differential crosstalk of the interconnect structure in high density packaging is put forward.Based on the coupling analysis of differential transmission line of interconnection structure,a four line differential structure crosstalk model is established.This model is used to perform equivalent analysis on the resistance,capacitance and inductance of the differential crosstalk interconnect structure and to solve the differential crosstalk problem of interconnect structure in high density packaging.The experiments show that the average error model is 0.042,which meets the accuracy requirements in the inhibition of the differential crosstalk problem of interconnect structure in high density packaging.

关 键 词：高密度封装 互连结构 差分串扰 

分 类 号：TN305.94[电子电信—物理电子学]