以计时电位法优化盲孔电镀添加剂的配方  

Optimization on combination of additives for blind via electroplating by chronopotentiometry

作　　者：邓智博 陈际达[1] 陈世金 张秀梅 杨凯 张柔 郭茂桂 廖金超 DENG Zhibo;CHEN Jida;CHEN Shijin;ZHANG Xiumei;YANG Kai;ZHANG Rou;GUO Maogui;LIAO Jinchao(School of Chemistry and Chemical Engineering,Chongqing University,Chongqing 401331,China;Bomin Electronics Ltd.,Meizhou 514000,China;State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China)

机构地区：[1]重庆大学化学化工学院,重庆401331 [2]博敏电子股份有限公司,广东梅州514000 [3]电子科技大学材料与能源学院,四川成都610054

出　　处：《电镀与涂饰》2021年第3期177-182,共6页Electroplating & Finishing

基　　金：国家自然科学基金(21878029,21706195,21676035);广东省“扬帆计划”先进印制电路关键技术研发及产业化项目(2015YT02D025)。

摘　　要：采用220 g/L CuSO_(4)·5H_(2)O+0.54 mol/L H_(2)SO_(4)作为酸性电镀铜填盲孔的基础镀液,加入Cl^(-)、二丙烷二磺酸钠(SPS)、聚乙二醇(PEG10000)、吡咯烷二硫代氨基甲酸铵盐(APTDC)作为添加剂,以计时电位法研究了镀铜铂盘电极在100 r/min和1 000 r/min转速下,这4种添加剂的质量浓度对阴极电位的影响,并记录不同对流强度下的电位差。得到优化的添加剂组合为:Cl^(-)-50 mg/L,PEG10000 150 mg/L,SPS 2.5 mg/L,APTDC 2.5 mg/L。采用此配方对盲孔进行电镀,填孔率在90%以上,平均面铜厚度为15.4μm,镀层光滑平整,抗热冲击性能好。Chloride ion,3,3’-dithiodipropane sulfonate(SPS),polyethylene glycol(PEG 10000),and ammonium pyrrolidine-1-carbodithioate(APTDC)were used as additives for blind via filling in an acidic bath comprising 220 g/L CuSO_(4)·5H_(2)O and 0.54 mol/L H_(2)SO_(4).The effects of the mass concentrations of the four said additives on the cathodic potential at a rotational speed of 100 r/min or 1000 r/min was studied by chronopotentiometry with a copper-plated platinum disc electrode.The potential difference at different convection intensities was recorded.The additive formulation was optimized as follows:Cl-50 mg/L,PEG10000150 mg/L,SPS 2.5 mg/L,and APTDC 2.5 mg/L.The blind via filling effectiveness was over 90%therewith.The copper coating electrodeposited at the surface was 15.4μm in thickness,smooth,uniform,and well resistant to thermal shock.

关 键 词：盲孔 电镀铜 填孔 计时电位法 阴极电位 厚度 

分 类 号：TQ153.14[化学工程—电化学工业]