功率器件封装用纳米浆料制备及其烧结性能研究进展  

Research Progress on Fabrication and Sinter Ability of Nano-Paste Applied to Power Device Packaging

作　　者：杨帆[1] 杭春进[1] 田艳红[1] YANG Fan;HANG Chunjin;TIAN Yanhong(State Key Lab of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《电子与封装》2021年第3期8-17,共10页Electronics & Packaging

基　　金：国家自然科学基金(51522503)。

摘　　要：随着SiC、GaN等第三代半导体在大功率器件上的应用,功率器件的工作温度可达到300℃,传统Sn基无铅钎料因为熔点低及钎焊温度高等原因无法满足要求。纳米浆料因其可以实现低温烧结、高温服役的特性吸引了国内外研究者的青睐。从纳米颗粒的合成、纳米浆料的制备、烧结性能以及可靠性等方面综述国内外纳米浆料的研究进展,同时对纳米浆料研究中存在的问题提出一些建议。With the application of SiC,GaN and other third-generation semiconductors in high-power devices,the working temperature of power devices reaches almost 300℃.The traditional Sn-based solder alloys cannot meet the requirements due to its low melting point or high packaging temperature.Nano-paste has been paid more attention by the researchers around the world because of its character of low temperature sintering and high temperature service.This paper mainly introduces the research progress of nano-paste based on the synthesis of nanoparticles,preparation of nanoparticle paste,the properties and reliability of nano-paste,and puts forward some suggestions on the existing problems in the study of nano-paste.

关 键 词：功率器件封装 第三代半导体 纳米浆料 低温烧结 

分 类 号：TG425[金属学及工艺—焊接] TN305.94[电子电信—物理电子学]