多层电镀法制备三维陶瓷基板技术研究  

Preparation of three-dimensional ceramic substrate using multilayer electroplating

作　　者：陈金祥[1] 田壮[1] 程浩 刘松坡 CHEN Jinxiang;TIAN Zhuang;CHENG Hao;LIU Songpo(School of Material Science and Engineering,Southwest University of Science and Technology,Mianyang 621010,Sichuan Province,China;Wuhan Ledstar Technology Co.,Ltd.,Wuhan 430074,China)

机构地区：[1]西南科技大学材料科学与工程学院,四川绵阳621010 [2]武汉利之达科技股份有限公司,湖北武汉430074

出　　处：《电子元件与材料》2021年第3期280-285,共6页Electronic Components And Materials

基　　金：湖北省技术创新重点项目(2016AAA069)。

摘　　要：针对光电器件气密封装需求,提出采用多层电镀技术制备含金属围坝的三维陶瓷基板。分析了该技术可行性,重点研究了电镀时间与电流密度对镀层厚度影响,随后采用多层图形电镀技术制备了含铜围坝的三维陶瓷基板,最后对其围坝结构精度、结合强度及可靠性进行了测试,并与粘接法制备的三维陶瓷基板进行对比。结果表明,采用多层电镀法制备的三维陶瓷基板具有围坝尺寸精度高(误差控制在10μm以内)、结合强度高(剪切强度高达45.5 MPa)、耐热性好(可耐受350℃高温)、腔体气密性好(漏率小于3×10^(-8) Pa·m^(3)·s^(-1))等技术优势,有望在光电器件(如深紫外LED、VCSEL激光器、加速度计、陀螺仪等)封装中得到应用。In order to meet the requirement of hermetic packaging for the optoelectronic devices,multilayer electroplating technology was proposed to prepare 3D ceramic substrate with metal dam(cavity).In this paper,the feasibility of this method was analyzed,the influence of electroplating time and current density on the thickness of electroplating copper was investigated.The three-dimensional ceramic substrate containing copper dam was prepared by multi-layer pattern electroplating technology.The pattern accuracy,bonding strength and reliability of the electroplating dam were tested and compared with that of 3D ceramic substrate prepared by adhesive bonding.The results show that the 3D ceramic substrate prepared by multi-layer electroplating has many advantages such as high dam dimensional accuracy(the error is within 10μm),high bonding strength(shear strength is high up to 45.5 MPa),high heat resistance(can withstand 350℃high temperature)and high air tightness(leakage rate is lower than 3×10^(-8) Pa·m^(3)·s^(-1)),which is promising to be used for the packaging of the optoelectronic devices(such as deep ultraviolet LED,VCSEL,accelerometer,and gyroscope,etc).

关 键 词：陶瓷基板 气密封装 电镀 可靠性 电子封装 

分 类 号：TN41[电子电信—微电子学与固体电子学]