正弦振动下PCBA翘曲对BGA焊点疲劳寿命的影响  

Influences of PCBA Warpage on Fatigue Life of BGA Solder Joints under Sinusoidal Vibration

作　　者：唐修卿 张剑 徐标[1] 胡志勇[1] TANG Xiuqing;ZHANG Jian;XU Biao;HU Zhiyong(The 32th Reasearch Institute of CETC,Shanghai 201800,China)

机构地区：[1]中国电子科技集团公司第三十二研究所,上海201800

出　　处：《电子产品可靠性与环境试验》2021年第3期1-5,共5页Electronic Product Reliability and Environmental Testing

摘　　要：为了获得印制板组件(PCBA)翘曲对球栅阵列(BGA)焊点振动疲劳寿命的影响,建立了带BGA芯片的PCBA的有限元模型。将翘曲等效成位移载荷作用在PCBA的螺钉孔上,利用瞬态分析计算出正弦振动下不同翘曲度PCBA上BGA焊点的应力值,并结合焊点材料的S-N疲劳曲线评估了PCBA翘曲对BGA焊点振动疲劳寿命的影响。结果表明:随着PCBA翘曲度的上升,BGA焊点的疲劳寿命呈现明显下降的趋势;在PCBA翘曲度一定的情况下,合理的螺钉孔与焊点间距能够明显地提高BGA焊点的振动疲劳寿命。In order to investigate the effect of printed circuit board assembly(PCBA)warpage on ball grid array(BGA)package solder joint vibration fatigue life,a finite element model of PCBA with BGA chip is constructed.The warpage is equivalent to displacement load acting on the screw hole of PCBA,and stress values of BGA solder joints on PCBA with different warpage values under sinusoidal vibration are calculated by transient analysis.The effect of PCBA warpage on the vibration fatigue life of BGA solder joints is evaluated by S-N fatigue curve of solder joint material.The results show that the vibration fatigue life of BGA solder joint decreases obviously with the increase of PCBA warpage value.When the warpage of PCBA is constant,the vibration fatigue life of BGA solder joint can be significantly improved by the reasonable distance from screw holes to BGA solder joints.

关 键 词：正弦振动 印刷板组件 翘曲 球栅阵列 焊点 疲劳寿命 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]