一种基于扇出晶圆级封装技术的控制模块设计  

Design of a Controller Module Based on Fan-Out Wafer Level Packaging Technology

作　　者：刘骁知 曾小平 冉万宁 丁杰 周佳明 LIU Xiaozhi;ZENG Xiaoping;RAN Wanning;DING Jie;ZHOU Jiaming(China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]中科芯集成电路有限公司,江苏无锡214072

出　　处：《电子与封装》2021年第8期17-21,共5页Electronics & Packaging

摘　　要：随着摩尔定律放缓,各种先进封装技术成为半导体产业的重要研究内容。同时,这些技术也为系统工程师们如何实现定制电路小型化提供了更多样的选择。在对已有SiP技术研究的基础上,基于国内工艺线,尝试使用扇出晶圆级封装技术实现一款控制模块,为该技术在数模混合系统小型化中的应用提供参考。With the slowdown of Moore's Law,advanced packaging technologies(APTs)became an important research subject for semiconductor industry.Meanwhile,APTs provided a variety of choices for system engineers to make their customized circuits minimized.Based on researches of the existing SiP technology and civil chip assembly line,a controller module,manufactured with fan-out wafer level packaging(FOWLP)technology was described,which made an example for FOWLP technology application in analog-digital mixed systems.

关 键 词：扇出晶圆级封装技术 控制模块 系统级封装 芯片级封装 

分 类 号：TN453[电子电信—微电子学与固体电子学]