LTCC电路基板大面积钎焊接头强度特性和失效分析  

Strength characteristics and failure analysis of large area soldered joint for LTCC circuit substrate

作　　者：王天石[1] 张怡[1] 王庆兵[1] 廖旭[1] 岳帅旗[1] 周杰文 Wang Tianshi;Zhang Yi;Wang Qingbing;Liao Xu;Yue Shuaiqi;Zhou Jiewen(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《焊接》2021年第4期28-34,63,共8页Welding & Joining

基　　金：国防科工局技术基础科研资助项目(JSZL2018210A004)。

摘　　要：采用钎焊工艺对LTCC电路基板与封装载体进行互联,针对大尺寸LTCC电路基板与封装载体钎焊接头的强度特性和失效特征进行了分析。结果表明,LTCC电路基板(焊盘为Au/Pt/Pd)与载体(表面镀层Au 0.5μm)采用Sn63Pb37共晶钎料大面积钎焊后接头的抗剪强度平均值为28.21 MPa,而异常试样的抗剪强度只有平均值的30%。LTCC焊盘较为疏松,内部密布贯穿孔洞,钎焊后锡铅钎料中的Sn元素通过孔洞进入到LTCC焊盘内部,且部分到达LTCC焊盘与LTCC电路基板的界面部位,并在LTCC焊盘内部形成了大面积的非枝晶状的金锡合金AuSn_(4)。抗剪强度异常试样LTCC焊盘与LTCC电路基板的烧结结合强度相较正常试样低,是导致界面失效、钎焊接头抗剪强度降低的主要原因。Soldering process was used to join LTCC circuit substrate and package carrier,the strength and failure characteristics of soldered joint of large size LTCC circuit substrate and package carrier were analyzed.The results showed that the average shear strength of large area soldered joint of LTCC circuit substrate(Au/Pt/Pd pad)and package carrier(surface coating Au 0.5μm)with Sn63Pb37 eutectic solder was 28.21 MPa,while the shear strength of abnormal samples were about 30%of the average value.The LTCC pads were loose with dense perforating holes.Sn elements of Sn-Pb solders entered into LTCC pads through holes after soldering.Some Sn elements reached the interface of LTCC pads and LTCC circuit substrate,and then formed a large area of non-dendritic AuSn_(4) inside the LTCC pads.Compared to the normal samples,the sintering bonding strength between LTCC pads and LTCC circuit substrate of abnormal ones was lower,which was the main reason of interface failure and decreasing shear strength.

关 键 词：低温共烧陶瓷 电路基板 大面积钎焊 抗剪强度 失效分析 

分 类 号：TG454[金属学及工艺—焊接]