微小量程联动薄膜压力敏感芯片仿真分析  

Simulation and Analysis of Micro-Range Linkage Thin Film Pressure Sensitive Chip

作　　者：任治凯 揣荣岩[1] 张冰 杨宇新 REN Zhikai;CHUAI Rongyan;ZHANG Bing;YANG Yuxin(School of Information Science and Engineering,Shenyang University of Technology,Shenyang 110870,China)

机构地区：[1]沈阳工业大学信息科学与工程学院,沈阳110870

出　　处：《微处理机》2021年第4期29-32,共4页Microprocessors

摘　　要：为顺应MEMS技术发展趋势、满足微小压力测量需求,基于SOI技术设计一种联动薄膜压力敏感结构。通过有限元软件COMSOL Multiphysics对结构进行建模仿真分析,按照仿真结果设计优化方案,确定新改进的结构参数。仿真给出所设计芯片的线性响应范围、灵敏度、非线性度等,结合理论分析完成有限元仿真及结构优化。分析表明该芯片能够对微小压力进行精确测量,性能卓越,可适用于各种航天器高度测量、气象环境检测以及医疗设备等专业技术领域。In order to comply with the development trend of MEMS technology and meet the demand of micro-pressure measurement,a kind of linkage thin film pressure sensitive structure is designed based on SOI technology.The finite element software COMSOL Multiphysics is used to model and simulate the structure,and the optimization scheme is designed according to the simulation results,and the new and improved structural parameters are determined.The linear response range,sensitivity and nonlinearity of the designed chip are given by simulation,and the finite element simulation and structural optimization are completed by combining theoretical analysis.The analysis shows that the chip can accurately measure micro-pressure,and has excellent performance.It can be applied to various professional technical fields such as spacecraft height measurement,meteorological environment detection and medical equipment.

关 键 词：微机电系统 压力敏感结构 微小量程 联动薄膜 SOI技术 非线性 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]