LTCC基板BGA焊接剪切强度影响因素分析  

Analysis on Influencing Factors of BGA Soldering Shear Strength on LTCC Substrate

作　　者：岳帅旗[1] 王贵化 游世娟 张刚[1] 王春富[1] YUE Shuaiqi;WANG Guihua;YOU Shijuan;ZHANG Gang;WANG Chunfu(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2021年第5期261-263,284,共4页Electronics Process Technology

摘　　要：通过横向对比的方法,分析了阻焊结构、通孔、焊球直径、阻焊开口尺寸对LTCC基板BGA焊接剪切强度的影响分析。结果表明,阻焊结构的引入能够大幅提升BGA焊盘的剪切强度,且通孔的引入不会降低Ni/Pd/Au焊盘的剪切强度。剪切强度会随着焊球直径显著变化,且可通过增加阻焊开口尺寸获得提升。The influences of solder mask,via introduction,ball diameter and solder mask size on shear strength of BGA soldering on LTCC substrate are analyzed by the method of comparison.The results show that the shear strength of BGA pad could be improved significantly by the introduction of solder mask and could not be reduced when the via introduced for Ni/Pd/Au pad,and that,the shear strength will be changed significantly along with the ball diameter and could be improved by increasing the solder mask opening size.

关 键 词：LTCC BGA 阻焊 剪切强度 

分 类 号：TN605[电子电信—电路与系统]