射频系统2.5D/3D封装结构的研究进展  

Research Progress of RF System 2.5D/3D Package Structure

作　　者：王豪杰[1] 崔碧峰[1] 王启东[2] 许建荣 王翔媛 李彩芳 WANG Haojie;CUI Bifeng;WANG Qidong;XU Jianrong;WANG Xiangyuan;LI Caifang(School of Microelectronics,Beijing University of Technology,Beijing 100124,China;Institute of Microelectronics of Chinese Academy of Sciences,Beijing 100029,China)

机构地区：[1]北京工业大学微电子学院,北京100124 [2]中国科学院微电子研究所,北京100029

出　　处：《电子与封装》2021年第9期32-42,共11页Electronics & Packaging

摘　　要：射频系统封装已经成为无线通信系统重要的集成技术,对于不断向高速率、小型化、多功能方向发展的无线通信系统,先进射频系统封装结构为其提供了坚实的基础。介绍了2.5D/3D射频系统封装结构的研究进程,重点分析了中介层结构、埋入结构、堆叠结构中的关键工艺,并从信号传输、电磁干扰、结构集成度等多角度出发,对不同封装结构做了深入剖析。探讨了射频系统封装结构发展遇到的难题,并对当今先进封装结构在未来射频系统中的应用做了简单的展望。RF system packaging has become an important integration technology of wireless communication system.Advanced RF system packaging structure provides a solid foundation for wireless communication system which is developing towards high speed,miniaturization and multi-function.This paper introduces the research process of 2.5D/3D RF system packaging structure,focuses on the analysis of the key technologies in the intermediate layer structure,embedded structure and stacked structure,and makes an in-depth analysis of different packaging structures from the perspectives of signal transmission,electromagnetic interference and structure integration.This paper discusses the problems encountered in the development of RF system packaging structure,and makes a simple prospect of the application of today's advanced packaging structure in the future RF system.

关 键 词：射频系统封装 中介层 堆叠 埋入 3D封装 

分 类 号：TN305.94[电子电信—物理电子学]