触变剂对降低锡珠数量的研究及防控措施  

Study and Control Measures on Decreasing of Solder Ball Quantities by Thixotropic Agent

作　　者：秦俊虎 卢梦迪 武信 何欢 王艳南 柳丽敏 QIN Jun-hu;LU Meng-di;WU Xin;HE Huan;WANG Yan-nan;LIU Li-ming(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming,Yunnan 650217,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650217

出　　处：《云南冶金》2021年第5期64-69,共6页Yunnan Metallurgy

基　　金：昆明市科技创新要素集聚计划(2019-1-R-24499)。

摘　　要：针对焊锡膏在实际应用中出现锡珠,导致元器件之间短路的问题,选择不同的触变剂制备助焊膏,并通过测试焊锡膏的黏度、触变指数、抗塌落性能及锡珠。研究结果表明,使用触变性能较差的的触变剂制备的焊锡膏粘度下降,触变指数较低,抗塌落性能较差,其产生锡珠的几率大大增加。在实际焊接工艺中,通过减少锡膏印刷量来可以有效减少锡珠的产生。Solder balls appear in the solder paste in practical use,solder ball will lead short circuit among the components and parts,so we selected different thixotropic agent for preparation of flux paste in the test,and we tested the viscosity,thixotropic index,anti-collapse performance and solder balls of solder paste.The research results show,when we used the thixotropic agent with bad thixotropic property,the prepared solder paste's viscosity was decreased,the thixotropic index was low,the anti-collapse performance was bad,the probability of producing solder ball was increased greatly.In the actual soldering process,we can reduce the printing volume of solder paste,it can effectively reduce the production of solder ball.

关 键 词：焊锡膏 触变剂 黏度 触变指数 锡珠 

分 类 号：TG146.14[一般工业技术—材料科学与工程]