真空汽相焊接技术在宇航产品中的应用  

Application of Vacuum Vapor Soldering Technology in Aerospace Products

作　　者：郭鹏飞[1] 马征 秦天飞 许艳凯 李晶[1] 高祥 甄榕 GUO Pengfei;MA Zheng;QIN Tianfei;XU Yankai;LI Jing;GAO Xiang;ZHEN Rong(Beijing Institute of Aerospace Control Devices,Beijing 100039,China)

机构地区：[1]北京航天控制仪器研究所,北京100039

出　　处：《电子工艺技术》2021年第6期338-340,348,共4页Electronics Process Technology

基　　金：装备预研航天科技联合基金(6141B061402)。

摘　　要：根据相关数据统计,电子产品的失效问题有75%是由于焊点失效造成的,特别是对于BGA器件,在真空环境下,焊点空洞率超过15%就可能在长期的恶劣环境下发生开裂,导致产品功能失效。目前,不同的单位都在采取各种措施来降低BGA焊点空洞率,主要有优化温度曲线、氮气保护或者采用真空回流焊的方式来实现,效果不尽相同,焊接问题仍时有发生。通过采用真空汽相焊技术解决BGA焊点空洞率高的问题,优化温度曲线及回流区的真空度,实现焊接空洞率小于5%,从而提高焊点在真空环境下的强度,满足航天产品深空探测需求。According to the statistics of relevant data,75%of the electronic products failure problems are caused by solder joint failure.Especially for BGA devices in vacuum environment,solder joint more than 15%void rate may crack in long-term harsh environment,resulting in product function failure.At present,different units are taking various measures to reduce the void rate of BGA solder joint,mainly by optimizing temperature curve,nitrogen protection or vacuum reflow soldering.The effects are not the same and soldering problems still occur.The vacuum vapor phase soldering technology is used to solve the problems of high void rate of BGA solder joint.Optimizing temperature curve and the vacuum degree of reflux zone realize the soldering void rate less than5%,so as to improve the strength of solder joint in vacuum environment and meet the needs of deep space exploration of aerospace products.

关 键 词：焊点失效 BGA 真空汽相焊 深空探测 

分 类 号：TN605[电子电信—电路与系统]