绿光激光切割不锈钢印刷模板可行性研究  

Research on Feasibility of Cutting Stainless Printing Stencil by Green Laser

作　　者：刘刚 张孔[1] 王运龙[1] LIU Gang;ZHANG Kong;WANG Yunlong(Key Lab of Aperture Array and Space Application,China Electronics Technology Group Corporation No.38 Research Institute,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所孔径阵列与空间探测安徽省重点实验室,合肥230088

出　　处：《电子与封装》2021年第12期40-44,共5页Electronics & Packaging

摘　　要：焊膏印刷模板在印制板和陶瓷基板的表面贴装中应用广泛,而激光切割常用于印刷模板的加工过程。绿光激光由于热效应大,在金属模板的加工过程中容易产生热应力从而造成模板的扭曲变形,使得金属模板无法满足焊膏的印刷要求。通过合理的参数优化可减小绿光激光热效应的负面影响,得到切口孔壁粗糙度小、模板相对平整的金属印刷模板,从而满足高质量的焊膏印刷需求。Solder printing stencils are widely used in surface mounting technology of printed circuit boards and ceramic boards,in which laser cutting is always applied to process printing stencils.Due to the large heating effect of green laser,metal stencils will be distorted which is caused by heat stress during processing,making metal stencils cannot meet solder printing.Negative influence of heating effect of green laser can be reduced via reasonable parameter optimization.As a result,relative flat metal stencil with low roughness notch is obtained,which can satisfy demands of high quality solder printing.

关 键 词：金属模板 激光切割 表面贴装 

分 类 号：TN305[电子电信—物理电子学] TG485[金属学及工艺—焊接]