VDMOS器件制造中的湿法工艺与设备研究  

Research on Wet Process and Wet Bench in the Manufacturing of VDMOS Power Devices

作　　者：宋文超[1] SONG Wenchao(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2021年第6期16-20,共5页Equipment for Electronic Products Manufacturing

摘　　要：简述了VDMOS器件制造工艺流程,介绍了其中常用的RCA清洗、SPM去胶、BOE腐蚀、Al腐蚀等湿法工艺,并对相关湿法设备的配置以及工作原理进行了介绍。The manufacturing process of VDMOS devices is briefly introduced,including common wet process of RCA cleaning,SPM photoresist strip,BOE wet etch,Al wet etch,and the configuration and working principle of related wet bench are explained.

关 键 词：VDMOS器件 湿法设备 RCA清洗 SPM去胶 BOE腐蚀 铝腐蚀 

分 类 号：TN305[电子电信—物理电子学]