LTCC高精密封装基板工艺技术研究  

Research on Process of LTCC Highly Precise Substrate for Packaging

作　　者：岳帅旗[1] 杨宇 刘港[1] 周义 王春富[1] 王贵华 YUE Shuaiqi;YANG Yu;LIU Gang;ZHOU Yi;WANG Chunfu;WANG Guihua(No.29 Institute of China Electronic Technology Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子与封装》2022年第1期13-17,共5页Electronics & Packaging

摘　　要：将激光修调、化学镀、光刻等技术与常规低温共烧陶瓷(Low Temperature Co-Fired Ceramic,LTCC)基板工艺技术相结合,对LTCC高精密封装基板的制作工艺进行开发和优化,并利用9K7材料进行了基板试制。结果显示,基板表面线条细度达到(50±5)μm,表面导体图形位置精度优于±10μm。基板表面Ni/Pd/Au镀层可焊性/耐焊性优良,2 mm×2 mm焊盘的锡铅焊接拉力强度达到2.8 kg以上,25μm金丝的键合强度达到10 g以上。基板表面阻焊开口尺寸达到(80±10)μm,具有良好的阻焊性能。对试制的LTCC高精密封装基板进行了装配和测试,在12 mm×13 mm的尺寸上实现4颗射频芯片的倒扣装配,功能模块在W波段具有良好的射频性能。LTCC高精密封装基板显现出高密度、高性能封装能力。Laser trimming,electroless plating and lithography technology are introduced into low temperature co-fired ceramic(LTCC)substrate process to the development of highly precise packaging substrate,and then the substrate trail production is made based on 9K7 material.Results show that,fine line with(50±5)μm width and±10μm position accuracy is achieved on substrate surface,Ni/Pd/Au film on substrate surface is with good soldering performance,soldering pull strength can be above 2.8 kg,pull strength can be above 10 g for 25μm gold wire,and solder mask with(80±10)μm size is also achieved on substrate surface.Assembly and test are made for the LTCC precise substrate,four RF-chips are flipped on substrate in 12 mm×13 mm,and the model shows good RF performance on W frequency band.The LTCC highly precise substrate shows advantages of high-density and high-performance packing.

关 键 词：低温共烧陶瓷 激光修调 化学镀 精密阻焊 芯片倒装 

分 类 号：TN305.94[电子电信—物理电子学]